| 104796 |
Wang Resin, 100-200 mesh 1% DVB, 0.50 - 1.30 mmole/g substitution |
201058-08-4 |
| M03536 |
Rink Amide MBHA resin 100-200 mesh, 0.3 - 0.8 mmol/g 1% DVB |
431041-83-7 |
| M02895 |
Rink amide linker |
126828-35-1 |
| 102712 |
Hydroxylamine-Wang resin (200-400 mesh, 0.8-1.1 mmol/g) |
- |
| M02899 |
HMBA (4-Hydroxymethylbenzoic acid) linker |
3006-96-0 |
| M02894 |
HMPA (4-(Hydroxymethyl)phenoxyacetic acid) linker |
68858-21-9 |
| 048029 |
Wang Resin 2% cross linked, 0.8-1.1mmol/g substitution 200-400 mesh, 2% DVB |
- |
| M03535 |
Rink Amide-AM resin |
- |
| M03525 |
2-Chlorotrityl Chloride Resin |
- |
| M03537 |
Sieber Amide resin |
- |
| 329411 |
2-(4-Formyl-3-methoxyphenoxy)acetic acid (linker) |
- |
| 226087 |
2-Hydroxy-5-dibenzosuberone (linker) |
- |
| 222454 |
4-(4-(1-Hydroxyethyl)-2-methoxy-5-nitrophenoxy)butanoic acid |
- |
| 493065 |
Fmoc-4-hydrazinobenzoic acid |
- |
| 364143 |
Fmoc-Suberol, Ramage linker |
- |
| M03524 |
Polystyrene: 1% divinylbenzene copolymer beads 200-400 mesh |
- |
